Quality
Product Change Notices (PCN)
Customer notifications for changes to any Magnias part that affect form, fit, function, quality, or reliability. Click a PCN number to request the full notification document — we will email it to you within one business day.
| PCN Number | Magnias P/N | PCN Date | Type of change | Reason for change | Sample availability | First production shipment |
|---|---|---|---|---|---|---|
| | PS0707A-F4 | 2026.04.24 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Package Form) | Die Shrink and Process Optimization | — | 2026.07.24 |
| | PT0502N-F2 | 2026.02.24 | Design, Wafer Fab, Assembly, Test, Software/Firmware, Other | Adding New Assembly House | 2026.05.01 | 2026.06.01 |
| | PT1284Y-F6 | 2026.01.15 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Package Form) | Package Type MSL1 with no Anti-static bag (ESD bag) | — | 2026.02.15 |
| | CMF205-N6L; PT1284Y-F6 | 2026.01.13 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Package Form) | Change Part Number | — | 2026.03.13 |
| | MI6603S-TW | 2026.01.09 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other | Adding an Additional Supplier for Bonding Wire | — | 2026.06.09 |
| | MBP0203L-D5 | 2025.12.24 | Design, Wafer Fab, Assembly, Test, Software/Firmware, Other | Change Quantity Per Reel | 2026.06.24 | 2026.03.24 |
| | PT0570J-D3 | 2025.07.01 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Package Form) | Package Type MSL1 with no Anti-static bag (ESD bag) | — | 2025.12.31 |
| | PS0522G-D5-GD7 | 2025.03.21 | Other | Adding Lead Frame Supplier | — | 2025.07.01 |
| | DFN2020-6L; PMS200P03AV; PMS14N03LV | 2025.02.25 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Adding new POD version) | Adding POD Type | — | 2025.05.25 |
| | PT1294Y-F2 | 2025.01.17 | Design, Wafer Fab, Assembly, Test, Software/Firmware, Other | Package per reel | — | 2025.04.17 |
| | B5819W | 2025.01.06 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other | Change the cathode band type and adjust the position of the control code in the marking | 2025.01.06 | — |
| | PT1290UL | 2024.11.21 | Design, Wafer Fab, Assembly, Test, Software/Firmware, Other (Change Part Number) | Change Part Number | 2024.11.21 | 2024.11.21 |
| | PS0310G-D5 | 2024.10.01 | Design | Adding New Assembly House and Adding Cathode Band | 2024.12.31 | 2025.01.31 |
| | PT2082J-F6 | 2024.07.11 | Other | Adding Package Form | 2024.09.11 | 2024.12.11 |
| | PT1284Y-F6 | 2024.07.11 | Other | Package Form | 2024.07.11 | 2024.08.11 |
| | MBP203L-D5 | 2024.07.09 | Assembly | for global going trend | 2024.07.22 | 2024.08.01 |
| | PT0502N-F4-A | 2024.07.01 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Adding new Reel version) | Adding POD Type | — | 2024.10.01 |
| | PS0486Q-F4 | 2024.06.27 | Other | Change Part Number | 2024.06.27 | 2024.09.27 |
| | MBP0203L-D5 | 2024.06.24 | Design, Wafer Fab, Assembly, Test, Software/Firmware, Other | Change Quantity Per Reel | 2024.09.24 | 2024.12.24 |
| | PS0394Y-S6 | 2024.05.08 | Assembly | Adding New Assembly House | — | — |
| | PZ0291A-F8 | 2024.04.30 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Material) | Change Material Factory Location | 2024.07.01 | 2024.08.01 |
| | PT0588J-F6 | 2023.07.26 | Assembly | for global going trend | 2023.08.11 | 2023.10.01 |
| | PS0310G-D3 | 2023.06.26 | Other | Molding Compound Factory Change | 2023.03.30 | 2023.06.30 |
| | PS0310G-D5 | 2023.06.26 | Other | Molding Compound Factory Change | 2023.03.30 | 2023.06.30 |
| | PS0522G-D5-GD7 | 2023.04.10 | Assembly | for global going trend | 2023.04.10 | 2023.08.10 |
| | PT0530Y-D5 | 2023.04.01 | Design | updated part number | 2023.12.01 | 2024.01.01 |
| | PZ0303Y-F10 | 2023.01.31 | Design, Wafer Fab, Assembly, Test, Software/Firmware, Other (Device End of Life-EOL) | Device End of Life(EOL) | 2023.10.20 | 2024.01.25 |
| | PT0502N-F4 | 2022.05.10 | Assembly | Adding New Assembly House | 2022.09.10 | 2022.11.10 |
| | PS0310G-F4; PS0522G-F4; PS0715G-F4; PT0505G-F4 | 2022.05.06 | Design, Wafer Fab, Assembly, Test, Software/Firmware | Change model’s name in Molding Compound | 2022.05.06 | 2022.06.06 |
| | PS0522G-F4 | 2021.07.13 | Other | Supplier Change | 2021.08.13 | 2021.12.24 |
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