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Thông báo thay đổi sản phẩm (PCN)
Thông báo cho khách hàng về các thay đổi của linh kiện Magnias ảnh hưởng đến hình dạng, lắp ráp, chức năng, chất lượng hay độ tin cậy. Nhấp vào số PCN để yêu cầu tài liệu thông báo đầy đủ — chúng tôi sẽ gửi email trong vòng một ngày làm việc.
| Số PCN | Mã Magnias | Ngày PCN | Loại thay đổi | Lý do thay đổi | Ngày có mẫu | Ngày xuất lô sản xuất đầu |
|---|---|---|---|---|---|---|
| | PS0707A-F4 | 2026.04.24 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Package Form) | Die Shrink and Process Optimization | — | 2026.07.24 |
| | PT0502N-F2 | 2026.02.24 | Design, Wafer Fab, Assembly, Test, Software/Firmware, Other | Adding New Assembly House | 2026.05.01 | 2026.06.01 |
| | PT1284Y-F6 | 2026.01.15 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Package Form) | Package Type MSL1 with no Anti-static bag (ESD bag) | — | 2026.02.15 |
| | CMF205-N6LPT1284Y-F6 | 2026.01.13 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Package Form) | Change Part Number | — | 2026.03.13 |
| | MI6603S-TW | 2026.01.09 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other | Adding an Additional Supplier for Bonding Wire | — | 2026.06.09 |
| | MBP0203L-D5 | 2025.12.24 | Design, Wafer Fab, Assembly, Test, Software/Firmware, Other | Change Quantity Per Reel | 2026.06.24 | 2026.03.24 |
| | PT0570J-D3 | 2025.07.01 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Package Form) | Package Type MSL1 with no Anti-static bag (ESD bag) | — | 2025.12.31 |
| | PS0522G-D5-GD7 | 2025.03.21 | Other | Adding Lead Frame Supplier | — | 2025.07.01 |
| | DFN2020-6LPMS200P03AVPMS14N03LV | 2025.02.25 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Adding new POD version) | Adding POD Type | — | 2025.05.25 |
| | PT1294Y-F2 | 2025.01.17 | Design, Wafer Fab, Assembly, Test, Software/Firmware, Other | Package per reel | — | 2025.04.17 |
| | B5819W | 2025.01.06 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other | Change the cathode band type and adjust the position of the control code in the marking | 2025.01.06 | — |
| | PT1290UL | 2024.11.21 | Design, Wafer Fab, Assembly, Test, Software/Firmware, Other (Change Part Number) | Change Part Number | 2024.11.21 | 2024.11.21 |
| | PS0310G-D5 | 2024.10.01 | Design | Adding New Assembly House and Adding Cathode Band | 2024.12.31 | 2025.01.31 |
| | PT2082J-F6 | 2024.07.11 | Other | Adding Package Form | 2024.09.11 | 2024.12.11 |
| | PT1284Y-F6 | 2024.07.11 | Other | Package Form | 2024.07.11 | 2024.08.11 |
| | MBP203L-D5 | 2024.07.09 | Assembly | for global going trend | 2024.07.22 | 2024.08.01 |
| | PT0502N-F4-A | 2024.07.01 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Adding new Reel version) | Adding POD Type | — | 2024.10.01 |
| | PS0486Q-F4 | 2024.06.27 | Other | Change Part Number | 2024.06.27 | 2024.09.27 |
| | MBP0203L-D5 | 2024.06.24 | Design, Wafer Fab, Assembly, Test, Software/Firmware, Other | Change Quantity Per Reel | 2024.09.24 | 2024.12.24 |
| | PS0394Y-S6 | 2024.05.08 | Assembly | Adding New Assembly House | — | — |
| | PZ0291A-F8 | 2024.04.30 | Design, Wafer Fab, Assembly, Test, Electrical/Mechanical specification, Software/Firmware, Other (Material) | Change Material Factory Location | 2024.07.01 | 2024.08.01 |
| | PT0588J-F6 | 2023.07.26 | Assembly | for global going trend | 2023.08.11 | 2023.10.01 |
| | PS0310G-D3 | 2023.06.26 | Other | Molding Compound Factory Change | 2023.03.30 | 2023.06.30 |
| | PS0310G-D5 | 2023.06.26 | Other | Molding Compound Factory Change | 2023.03.30 | 2023.06.30 |
| | PS0522G-D5-GD7 | 2023.04.10 | Assembly | for global going trend | 2023.04.10 | 2023.08.10 |
| | PT0530Y-D5 | 2023.04.01 | Design | updated part number | 2023.12.01 | 2024.01.01 |
| | PZ0303Y-F10 | 2023.01.31 | Design, Wafer Fab, Assembly, Test, Software/Firmware, Other (Device End of Life-EOL) | Device End of Life(EOL) | 2023.10.20 | 2024.01.25 |
| | PT0502N-F4 | 2022.05.10 | Assembly | Adding New Assembly House | 2022.09.10 | 2022.11.10 |
| | PS0310G-F4PS0522G-F4PS0715G-F4PT0505G-F4 | 2022.05.06 | Design, Wafer Fab, Assembly, Test, Software/Firmware | Change model’s name in Molding Compound | 2022.05.06 | 2022.06.06 |
| | PS0522G-F4 | 2021.07.13 | Other | Supplier Change | 2021.08.13 | 2021.12.24 |
Không có PCN phù hợp với bộ lọc. Thử từ khóa khác.